Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12978975Application Date: 2010-12-27
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Publication No.: US08426903B2Publication Date: 2013-04-23
- Inventor: Hiroshi Kujirai
- Applicant: Hiroshi Kujirai
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2009-297229 20091228
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
There are provided: a silicon pillar that is formed almost perpendicularly to a main surface of a substrate; first and second impurity diffused layers that are arranged in a lower part and an upper part of the silicon pillar, respectively; a gate electrode that is arranged horizontally through the silicon pillar; and a gate insulating film that is arranged between the gate electrode and the silicon pillar. The silicon pillar consequently has a small volume, which makes it possible to reduce the leak current of the transistor or thyristor formed in the silicon pillar.
Public/Granted literature
- US20110156120A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2011-06-30
Information query
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