Invention Grant
- Patent Title: Semiconductor device integrated with converter and package structure thereof
- Patent Title (中): 集成转换器的半导体器件及其封装结构
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Application No.: US13013832Application Date: 2011-01-26
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Publication No.: US08426914B2Publication Date: 2013-04-23
- Inventor: Wei-Chieh Lin
- Applicant: Wei-Chieh Lin
- Applicant Address: TW Hsinchu
- Assignee: Sinopower Semiconductor Inc.
- Current Assignee: Sinopower Semiconductor Inc.
- Current Assignee Address: TW Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW99129674A 20100902
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
The present invention provides a semiconductor device including a semiconductor substrate having a first conductive type, at least one high-side transistor device and at least one low-side transistor device. The high-side transistor device includes a doped high-side base region having a second conductive type, a doped high-side source region having the first conductive type and a doped drain region having the first conductive type. The doped high-side base region is disposed within the semiconductor substrate, and the doped high-side source region and the doped drain region are disposed within the doped high-side base region. The doped high-side source region is electrically connected to the semiconductor substrate, and the semiconductor substrate is regarded as a drain of the low-side transistor device.
Public/Granted literature
- US20120056277A1 SEMICONDUCTOR DEVICE INTEGRATED WITH CONVERTER AND PACKAGE STRUCTURE THEREOF Public/Granted day:2012-03-08
Information query
IPC分类: