Invention Grant
US08426914B2 Semiconductor device integrated with converter and package structure thereof 有权
集成转换器的半导体器件及其封装结构

  • Patent Title: Semiconductor device integrated with converter and package structure thereof
  • Patent Title (中): 集成转换器的半导体器件及其封装结构
  • Application No.: US13013832
    Application Date: 2011-01-26
  • Publication No.: US08426914B2
    Publication Date: 2013-04-23
  • Inventor: Wei-Chieh Lin
  • Applicant: Wei-Chieh Lin
  • Applicant Address: TW Hsinchu
  • Assignee: Sinopower Semiconductor Inc.
  • Current Assignee: Sinopower Semiconductor Inc.
  • Current Assignee Address: TW Hsinchu
  • Agent Winston Hsu; Scott Margo
  • Priority: TW99129674A 20100902
  • Main IPC: H01L29/00
  • IPC: H01L29/00
Semiconductor device integrated with converter and package structure thereof
Abstract:
The present invention provides a semiconductor device including a semiconductor substrate having a first conductive type, at least one high-side transistor device and at least one low-side transistor device. The high-side transistor device includes a doped high-side base region having a second conductive type, a doped high-side source region having the first conductive type and a doped drain region having the first conductive type. The doped high-side base region is disposed within the semiconductor substrate, and the doped high-side source region and the doped drain region are disposed within the doped high-side base region. The doped high-side source region is electrically connected to the semiconductor substrate, and the semiconductor substrate is regarded as a drain of the low-side transistor device.
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