Invention Grant
- Patent Title: Penetrating implant for forming a semiconductor device
- Patent Title (中): 用于形成半导体器件的穿透植入物
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Application No.: US13107783Application Date: 2011-05-13
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Publication No.: US08426927B2Publication Date: 2013-04-23
- Inventor: Giuseppe Curello , Ian R. Post , Nick Lindert , Walid M. Hafez , Chia-Hong Jan , Mark T. Bohr
- Applicant: Giuseppe Curello , Ian R. Post , Nick Lindert , Walid M. Hafez , Chia-Hong Jan , Mark T. Bohr
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02

Abstract:
A semiconductor device and method to form a semiconductor device is described. The semiconductor includes a gate stack disposed on a substrate. Tip regions are disposed in the substrate on either side of the gate stack. Halo regions are disposed in the substrate adjacent the tip regions. A threshold voltage implant region is disposed in the substrate directly below the gate stack. The concentration of dopant impurity atoms of a particular conductivity type is approximately the same in both the threshold voltage implant region as in the halo regions. The method includes a dopant impurity implant technique having sufficient strength to penetrate a gate stack.
Public/Granted literature
- US20110215422A1 PENETRATING IMPLANT FOR FORMING A SEMICONDUCTOR DEVICE Public/Granted day:2011-09-08
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