Invention Grant
- Patent Title: Integrated circuit packaging system with a stack package and method of manufacture thereof
- Patent Title (中): 具有堆叠封装的集成电路封装系统及其制造方法
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Application No.: US12484158Application Date: 2009-06-12
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Publication No.: US08426955B2Publication Date: 2013-04-23
- Inventor: HeeJo Chi , YeongIm Park , HyungMin Lee
- Applicant: HeeJo Chi , YeongIm Park , HyungMin Lee
- Applicant Address: SG Singapore
- Assignee: STATS Chippac Ltd.
- Current Assignee: STATS Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a stack board; connecting a device over the stack board; forming a stack encapsulant having a cavity and a pedestal over the device and having a shaped perimeter side from a pedestal surface of the pedestal to the stack board; and attaching a stack adhesive to a base package and the pedestal, the cavity and the shaped perimeter side providing a space for connections to the stack board.
Public/Granted literature
- US20100314738A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACK PACKAGE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-12-16
Information query
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