Invention Grant
US08426956B2 Semiconductor package structure having plural packages in a stacked arrangement
有权
具有堆叠布置的多个封装的半导体封装结构
- Patent Title: Semiconductor package structure having plural packages in a stacked arrangement
- Patent Title (中): 具有堆叠布置的多个封装的半导体封装结构
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Application No.: US12855322Application Date: 2010-08-12
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Publication No.: US08426956B2Publication Date: 2013-04-23
- Inventor: In-Sang Song , Hye-Jin Kim , Kyung-Man Kim
- Applicant: In-Sang Song , Hye-Jin Kim , Kyung-Man Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0100892 20091022
- Main IPC: H01L23/488
- IPC: H01L23/488
Abstract:
The semiconductor package structure includes first and second packages. The first package has at least one first semiconductor chip disposed on a first printed circuit board, and at least one first pad disposed on the at least one first semiconductor chip. The second package has at least one second pad disposed on the first package, and at least one second semiconductor chip disposed on the at least one second pad. The at least one first semiconductor chip is electrically connected to the first printed circuit board. The at least one second pad is electrically connected to the at least one second semiconductor chip. The at least one second pad faces the at least one first pad.
Public/Granted literature
- US20110095424A1 SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2011-04-28
Information query
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