Invention Grant
- Patent Title: Interconnect for an optoelectronic device
- Patent Title (中): 互连用于光电子器件
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Application No.: US12893765Application Date: 2010-09-29
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Publication No.: US08426974B2Publication Date: 2013-04-23
- Inventor: Ryan Linderman , Keith Johnston , Thomas Phu , Matthew Dawson
- Applicant: Ryan Linderman , Keith Johnston , Thomas Phu , Matthew Dawson
- Applicant Address: US CA San Jose
- Assignee: SunPower Corporation
- Current Assignee: SunPower Corporation
- Current Assignee Address: US CA San Jose
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature.
Public/Granted literature
- US20120074576A1 INTERCONNECT FOR AN OPTOELECTRONIC DEVICE Public/Granted day:2012-03-29
Information query
IPC分类:
