Invention Grant
US08426977B2 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
失效
半导体装置，半导体装置的制造方法以及相机模块
- Patent Title: Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
- Patent Title (中): 半导体装置，半导体装置的制造方法以及相机模块
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Application No.: US12539037Application Date: 2009-08-11
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Publication No.: US08426977B2Publication Date: 2013-04-23
- Inventor: Kazumasa Tanida , Hideko Mukaida , Susumu Harada , Chiaki Takubo
- Applicant: Kazumasa Tanida , Hideko Mukaida , Susumu Harada , Chiaki Takubo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2008-207830 20080812
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor apparatus includes, a semiconductor substrate having first and second main surfaces and a through hole connecting the first and second main surfaces; a first insulation layer arranged on the first main surface, and having an opening corresponding to the through hole; a first conductive layer arranged on the first insulation layer, and covering the through hole; a second insulation layer arranged on an inner wall of the through hole and the second surface; a second conductive layer arranged in the through hole and on the second insulation layer, the second conductive layer contacting the first conductive layer; and a filling member arranged on the second conductive layer in the through hole, and having a gap between the second conductive layer on the first main surface side.
Public/Granted literature
- US20100038741A1 SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS, AND CAMERA MODULE Public/Granted day:2010-02-18
Information query
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