Invention Grant
US08426978B2 Semiconductor device including a first wiring having a bending portion and a via including the bending portion
有权
半导体器件包括具有弯曲部分的第一布线和包括弯曲部分的通孔
- Patent Title: Semiconductor device including a first wiring having a bending portion and a via including the bending portion
- Patent Title (中): 半导体器件包括具有弯曲部分的第一布线和包括弯曲部分的通孔
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Application No.: US12920442Application Date: 2010-01-14
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Publication No.: US08426978B2Publication Date: 2013-04-23
- Inventor: Miwa Ichiryu , Hiroyuki Uehara , Hidetoshi Nishimura
- Applicant: Miwa Ichiryu , Hiroyuki Uehara , Hidetoshi Nishimura
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-033359 20090217
- International Application: PCT/JP2010/000171 WO 20100114
- International Announcement: WO2010/095346 WO 20100826
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A first wiring (1) has a bending portion (2), a first wiring region (1a) extending from the bending portion (2) in the X direction, and a second wiring region (1b) extending from the bending portion (2) in the Y direction. A via (3) is formed under the wiring (1). The via (3) is formed so as not to overlap with a region of the bending portion (2) in the first wiring region (1a). The length of the via (3) in the X direction (x) is longer than the length thereof in the Y direction (y) and both ends of the via (3) in the Y direction overlap with both ends of the first wiring region (1a) in the Y direction.
Public/Granted literature
- US20110006439A1 SEMICONDUCTOR DEVICE, BASIC CELL, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2011-01-13
Information query
IPC分类:
