Invention Grant
- Patent Title: Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component
- Patent Title (中): 正型感光性树脂组合物，抗蚀剂图案的制造方法和电子部件
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Application No.: US13060763Application Date: 2009-09-02
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Publication No.: US08426985B2Publication Date: 2013-04-23
- Inventor: Hiroshi Matsutani , Takumi Ueno , Alexandre Nicolas , Ken Nanaumi
- Applicant: Hiroshi Matsutani , Takumi Ueno , Alexandre Nicolas , Ken Nanaumi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2008-227182 20080904
- International Application: PCT/JP2009/065336 WO 20090902
- International Announcement: WO2010/026988 WO 20100311
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.
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