Invention Grant
- Patent Title: Surface acoustic wave device
- Patent Title (中): 表面声波装置
-
Application No.: US13347730Application Date: 2012-01-11
-
Publication No.: US08427032B2Publication Date: 2013-04-23
- Inventor: Kenji Nishiyama , Takeshi Nakao , Michio Kadota
- Applicant: Kenji Nishiyama , Takeshi Nakao , Michio Kadota
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-169165 20090717
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
A surface acoustic wave device prevents a decrease in yield and a decrease in reliability, such as an impulse withstand voltage, and achieves good frequency characteristics, even when using higher frequencies. The surface acoustic wave device includes an IDT electrode disposed on a piezoelectric substrate, and a first insulating film and at least one second insulating film disposed on the IDT electrode, and utilizes a higher-order mode of an SH wave, in which the acoustic velocity of a surface acoustic wave in the first insulating film located closer to the IDT electrode than the insulating film at an outermost surface is higher than the acoustic velocity of a surface acoustic wave in the second insulating film located at the outermost surface.
Public/Granted literature
- US20120104897A1 SURFACE ACOUSTIC WAVE DEVICE Public/Granted day:2012-05-03
Information query
IPC分类: