Invention Grant
- Patent Title: Temperature compensation circuit
- Patent Title (中): 温度补偿电路
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Application No.: US13403121Application Date: 2012-02-23
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Publication No.: US08427227B2Publication Date: 2013-04-23
- Inventor: Koji Horie , Minoru Nagata
- Applicant: Koji Horie , Minoru Nagata
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2009-6737 20090115
- Main IPC: G05F3/02
- IPC: G05F3/02 ; H03K17/14

Abstract:
In one embodiment, a temperature compensation circuit includes a bias circuit configured to output a bias current having a current value increasing in proportion to an absolute temperature in a low-temperature region, and having a greater current value than the current value proportional to the absolute temperature in a high-temperature region, and a transistor which is supplied with the bias current. The bias circuit includes first to third transistors, a fourth transistor through which a first current flows, a fifth transistor, a sixth transistor through which a second current flows, and a control circuit having a connection terminal capable of being connected with an external resistor for adjusting a magnitude of the second current. The bias circuit generates a third current by adding the first current to the second current, and outputs the bias current that is the third current or a fourth current depending on the third current.
Public/Granted literature
- US20120212284A1 TEMPERATURE COMPENSATION CIRCUIT Public/Granted day:2012-08-23
Information query
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