Invention Grant
- Patent Title: Solid-state image pickup device, method for manufacturing the same, and electronic apparatus
- Patent Title (中): 固体摄像装置及其制造方法以及电子设备
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Application No.: US12881687Application Date: 2010-09-14
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Publication No.: US08427568B2Publication Date: 2013-04-23
- Inventor: Takeshi Takeda
- Applicant: Takeshi Takeda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2009-223233 20090928
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N9/64 ; H01L31/062 ; H01L27/148 ; H01L21/00
Abstract:
Disclosed herein is a solid-state image pickup device, including a pixel, the pixel including: a light receiving section; a charge transfer path; a transfer electrode; a readout gate section; and a readout electrode.
Public/Granted literature
- US20110074969A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2011-03-31
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