A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other. A thermal shunt comprised of a thermally conductive material is disposed between the circuit board and the front surface of the enclosure and provides a thermally conductive path between at least some of the electronic components and the front surface of the enclosure, where the front surface of the enclosure conducts heat to at least one of the top, left, and right surfaces of the enclosure.