Invention Grant
- Patent Title: Inspecting method, inspecting system, and method for manufacturing electronic devices
- Patent Title (中): 检查方法，检查系统和电子设备制造方法
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Application No.: US11431709Application Date: 2006-05-11
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Publication No.: US08428336B2Publication Date: 2013-04-23
- Inventor: Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
- Applicant: Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP10-341991 19981201
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.
Public/Granted literature
- US20060274932A1 Inspecting method, inspecting system, and method for manufacturing electronic devices Public/Granted day:2006-12-07
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