A hybrid integrated module includes a semiconductor die mechanically coupled face-to-face to an integrated device in which the substrate has been removed. For example, the integrated circuit may include an optical waveguide that conveys an optical signal, which is fabricated on a silicon-on-insulator (SOI) wafer in which the back-side silicon substrate or handler has been completely removed. Moreover, an optical device may be disposed on the bottom surface of an oxide layer (such as a buried-oxide layer) in the integrated device, and the geometry and materials in the integrated device may be selected and/or defined so that the optical signal is evanescently coupled between the optical waveguide and the optical device.