Invention Grant
- Patent Title: Wireless headset and multipoint pairing method for the same
- Patent Title (中): 无线耳机和多点配对方法相同
-
Application No.: US12351270Application Date: 2009-01-09
-
Publication No.: US08428666B2Publication Date: 2013-04-23
- Inventor: Deok-Seong Kim
- Applicant: Deok-Seong Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2008-0007059 20080123
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A wireless headset and multi-point pairing method for the same are disclosed. The wireless headset can be easily paired with multiple wireless-enabled devices. The method includes establishing a wireless connection to a first wireless device during a wireless connection mode, requesting a mode transition to a pairing mode during the wireless connection mode, making a mode transition from the wireless connection mode to the pairing mode without turning off the headset, performing a pairing procedure with a second wireless device during the pairing mode, and establishing a wireless connection to the second wireless device in addition to the first wireless device after the pairing procedure is completed.
Public/Granted literature
- US20090186580A1 WIRELESS HEADSET AND MULTIPOINT PAIRING METHOD FOR THE SAME Public/Granted day:2009-07-23
Information query