Invention Grant
US08429381B1 Micro grid computing system in tiered structure of bridge coupled processing hub with sensor and actuator docking bay
有权
具有传感器和执行器对接托架的桥耦合处理集线器分层结构的微格网计算系统
- Patent Title: Micro grid computing system in tiered structure of bridge coupled processing hub with sensor and actuator docking bay
- Patent Title (中): 具有传感器和执行器对接托架的桥耦合处理集线器分层结构的微格网计算系统
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Application No.: US13438267Application Date: 2012-04-03
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Publication No.: US08429381B1Publication Date: 2013-04-23
- Inventor: Ian Edward Oakenfull
- Applicant: Ian Edward Oakenfull
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent John Pivnichny
- Main IPC: G06F15/16
- IPC: G06F15/16 ; H05K7/00

Abstract:
A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein. Each complex shape is either a power hub including rechargeable batteries or a processor hub including processors. A sensor module is latched in a sensor docking bay and an actuator module is latched in an actuator docking bay of each complex shape in one or more tiers of the multiple tiers.
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