Invention Grant
- Patent Title: Three dimensional integrated circuits
- Patent Title (中): 三维集成电路
-
Application No.: US11363304Application Date: 2006-02-27
-
Publication No.: US08429585B2Publication Date: 2013-04-23
- Inventor: Raminda Udaya Madurawe
- Applicant: Raminda Udaya Madurawe
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.
Public/Granted literature
- US20060150137A1 Three dimensional integrated circuits Public/Granted day:2006-07-06
Information query
