Invention Grant
US08431222B2 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
有权
具有改进粘结的电路材料，其制造方法和由其形成的制品
- Patent Title: Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
- Patent Title (中): 具有改进粘结的电路材料，其制造方法和由其形成的制品
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Application No.: US11829406Application Date: 2007-07-27
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Publication No.: US08431222B2Publication Date: 2013-04-30
- Inventor: Sankar K. Paul
- Applicant: Sankar K. Paul
- Applicant Address: US IL Lincolnwood
- Assignee: World Properties, Inc.
- Current Assignee: World Properties, Inc.
- Current Assignee Address: US IL Lincolnwood
- Agency: Cantor Colburn LLP
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B15/08 ; B05D1/40
Abstract:
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
Public/Granted literature
- US20080038528A1 CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM Public/Granted day:2008-02-14
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