Invention Grant
- Patent Title: Circuit modules and method of managing the same
- Patent Title (中): 电路模块及其管理方法
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Application No.: US13155463Application Date: 2011-06-08
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Publication No.: US08431827B2Publication Date: 2013-04-30
- Inventor: Hiroshi Nishikawa , Taro Hirai
- Applicant: Hiroshi Nishikawa , Taro Hirai
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-319852 20081216
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.
Public/Granted literature
- US20110239457A1 CIRCUIT MODULES AND METHOD OF MANAGING THE SAME Public/Granted day:2011-10-06
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