Invention Grant
- Patent Title: Microstructural body and production method therefor
- Patent Title (中): 微结构体及其制备方法
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Application No.: US13047644Application Date: 2011-03-14
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Publication No.: US08432661B2Publication Date: 2013-04-30
- Inventor: Takahisa Kato , Shinichiro Watanabe
- Applicant: Takahisa Kato , Shinichiro Watanabe
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2010-058727 20100316
- Main IPC: H01G7/00
- IPC: H01G7/00

Abstract:
A microstructural body includes a substrate such as an electrode substrate, a support portion, one post that fixes the support portion to the substrate, a frame-shaped movable portion provided around outer periphery of the support portion, and an elastic support portion that elastically connects the movable portion and the support portion. The elastic support portion supports the frame-shaped movable portion such that the movable portion is movable relative to the support portion. The elastic support portion includes torsion springs and an elastically deformable connecting portion.
Public/Granted literature
- US20110228440A1 MICROSTRUCTURAL BODY AND PRODUCTION METHOD THEREFOR Public/Granted day:2011-09-22
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