Invention Grant
- Patent Title: Method for fabricating molded coil
- Patent Title (中): 制造线圈的方法
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Application No.: US13554463Application Date: 2012-07-20
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Publication No.: US08434213B2Publication Date: 2013-05-07
- Inventor: Tomohiro Nomura , Hirozumi Kon , Satoshi Tokuda , Osamu Hinata
- Applicant: Tomohiro Nomura , Hirozumi Kon , Satoshi Tokuda , Osamu Hinata
- Applicant Address: JP Tokyo
- Assignee: Keihin Corporation
- Current Assignee: Keihin Corporation
- Current Assignee Address: JP Tokyo
- Agency: Squire Sanders (US) LLP
- Priority: JP2007-260860 20071004; JP2007-260861 20071004; JP2007-278948 20071026; JP2007-278949 20071026; JP2008-014550 20080125
- Main IPC: H01F7/06
- IPC: H01F7/06

Abstract:
There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig.
Public/Granted literature
- US20120280424A1 COIL WINDING SYSTEM AND METHOD FOR FABRICATING MOLDED COIL Public/Granted day:2012-11-08
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