Invention Grant
- Patent Title: Liquid ejection head manufacturing method
- Patent Title (中): 液体喷头制造方法
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Application No.: US13278204Application Date: 2011-10-21
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Publication No.: US08434229B2Publication Date: 2013-05-07
- Inventor: Akihiko Okano , Yasuaki Tominaga
- Applicant: Akihiko Okano , Yasuaki Tominaga
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2010-261606 20101124
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; B41J2/15 ; B41J2/145

Abstract:
A liquid ejection head manufacturing method includes, in the following order, preparing a substrate having a flow path mold; arranging a first layer serving as a flow path wall member so as to cover the flow path mold; curing a portion of the first layer serving as a flow path sidewall; arranging a second layer so as to cover the cured portion of the first layer and the flow path mold; planarizing the second layer by pressing the second layer toward the substrate; arranging the ejection port in the first layer and the second layer; and forming the flow path by removing the flow path mold.
Public/Granted literature
- US20120124835A1 LIQUID EJECTION HEAD MANUFACTURING METHOD Public/Granted day:2012-05-24
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