Invention Grant
- Patent Title: Methods and systems for supporting a workpiece and for heat-treating the workpiece
- Patent Title (中): 用于支撑工件和热处理工件的方法和系统
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Application No.: US13359857Application Date: 2012-01-27
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Publication No.: US08434341B2Publication Date: 2013-05-07
- Inventor: David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
- Applicant: David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
- Applicant Address: US CA Fremont
- Assignee: Mattson Technology, Inc.
- Current Assignee: Mattson Technology, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: B21D37/16
- IPC: B21D37/16 ; B23H11/00
Abstract:
An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.
Public/Granted literature
- US20120118867A1 METHODS AND SYSTEMS FOR SUPPORTING A WORKPIECE AND FOR HEAT-TREATING THE WORKPIECE Public/Granted day:2012-05-17
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