Invention Grant
- Patent Title: Preloaded pressure sensor module
- Patent Title (中): 预压力传感器模块
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Application No.: US13113426Application Date: 2011-05-23
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Publication No.: US08434369B2Publication Date: 2013-05-07
- Inventor: Chih-Sheng Hou , Yann-Cherng Chern
- Applicant: Chih-Sheng Hou , Yann-Cherng Chern
- Applicant Address: TW
- Assignee: Universal Cement Corporation
- Current Assignee: Universal Cement Corporation
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: G01L9/12
- IPC: G01L9/12 ; G01L9/06 ; G01L13/02 ; H02B1/00

Abstract:
A preloaded pressure sensor module (PPSM) is disclosed, where the PPSM outputs a linear Conductivity Response versus Pressure Force input. The PPSM has a convex or concave profile which is prepared by pressing a flat pressure sensor device onto to a convex or concave base respectively so that the pressure sensitive layer inside the sensor module is bent and displays a preloaded effect.
Public/Granted literature
- US20120297885A1 PRELOADED PRESSURE SENSOR MODULE Public/Granted day:2012-11-29
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