Invention Grant
- Patent Title: Configurable modular labeling machine and methods of making same
- Patent Title (中): 可组态模块化标签机及其制作方法
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Application No.: US12100553Application Date: 2008-04-10
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Publication No.: US08434540B2Publication Date: 2013-05-07
- Inventor: Johannes S. Lenkl
- Applicant: Johannes S. Lenkl
- Applicant Address: US CA Pasadena
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Pasadena
- Agency: Avery Dennison Corporation
- Main IPC: B65B51/06
- IPC: B65B51/06

Abstract:
There is disclosed a configurable modular labeling machine and a method of making same. The machine can be selectively assembled in a number of different configurations. The machine has a frame or housing that can mount selectively positionable applicator and rewind modules. The applicator module includes a plate that can carry direction-changing and feed rolls and can mount a dispensing mechanism. The rewind module can include a plate that can mount direction-changing rolls and a rewind.
Public/Granted literature
- US20090255633A1 CONFIGURABLE MODULAR LABELING MACHINE AND METHODS OF MAKING SAME Public/Granted day:2009-10-15
Information query
IPC分类: