Invention Grant
- Patent Title: Joining method and reflow apparatus
- Patent Title (中): 连接方式和回流装置
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Application No.: US13090858Application Date: 2011-04-20
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Publication No.: US08434658B2Publication Date: 2013-05-07
- Inventor: Tetsuji Ishikawa
- Applicant: Tetsuji Ishikawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2009-002515 20090108
- Main IPC: B23K20/00
- IPC: B23K20/00
Abstract:
A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.
Public/Granted literature
- US20110192536A1 JOINING METHOD AND REFLOW APPARATUS Public/Granted day:2011-08-11
Information query
