Invention Grant
- Patent Title: Micro-ball loading device and loading method
- Patent Title (中): 微球加载装置和装载方法
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Application No.: US12025400Application Date: 2008-02-04
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Publication No.: US08434664B2Publication Date: 2013-05-07
- Inventor: Kengo Aoya
- Applicant: Kengo Aoya
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Priority: JP2007-025596 20070205
- Main IPC: B23K20/03
- IPC: B23K20/03

Abstract:
A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (200) may have the following parts: backing plate (220) supporting substrate (100) such that plural terminal regions (108) formed on one surface of substrate (100) are free, transfer mask (210), which contains a metal mask and has plural through-holes (216) formed corresponding to plural terminal regions (108) of the substrate, fixing block (230) onto which end portions (210a) of the transfer mask are fixed such that transfer mask (210) faces one surface of the substrate, and magnet part (240), which attaches transfer mask (210) by magnetic force to the side of backing plate (220); for magnet part (240), the attachment force to the center portion of the substrate is less than that of the peripheral edge portion.
Public/Granted literature
- US20090001132A1 MICRO-BALL LOADING DEVICE AND LOADING METHOD Public/Granted day:2009-01-01
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