Invention Grant
- Patent Title: Crack embossing using diamond technology
- Patent Title (中): 使用钻石技术的破裂压花
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Application No.: US13075270Application Date: 2011-03-30
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Publication No.: US08434675B2Publication Date: 2013-05-07
- Inventor: Patrick Faith
- Applicant: Patrick Faith
- Applicant Address: US CA San Francisco
- Assignee: Visa International Service Association
- Current Assignee: Visa International Service Association
- Current Assignee Address: US CA San Francisco
- Agency: Kilpatrick, Townsend & Stockton
- Main IPC: G06F17/00
- IPC: G06F17/00 ; G06F7/08 ; G06Q40/00 ; G07D11/00 ; G07F19/00 ; G06K5/00 ; G06K19/00 ; G06K19/06 ; B44F1/06 ; D06N7/04

Abstract:
A portable consumer device having a substrate layer, a protective layer and a diamond-based brittle material layer having an intentionally created unique fissure or cracked patterns or crystal zone boundaries and systems and methods for making and using same are disclosed. The diamond-based brittle material layer includes a diamond material. The unique random fissure or cracked pattern and crystal zone boundaries, or the electromagnetic signature based thereon, of the brittle material layer are detected and used to authenticate the portable consumer device.
Public/Granted literature
- US20110284626A1 CRACK EMBOSSING USING DIAMOND TECHNOLOGY Public/Granted day:2011-11-24
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