Invention Grant
- Patent Title: Attaching structure and electronic device using same
- Patent Title (中): 安装结构和使用电子设备
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Application No.: US12903304Application Date: 2010-10-13
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Publication No.: US08434798B2Publication Date: 2013-05-07
- Inventor: Ming-Chun Hsiung
- Applicant: Ming-Chun Hsiung
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010213623 20100630
- Main IPC: E05C5/04
- IPC: E05C5/04 ; E05C5/00
Abstract:
An attaching structure is used for assembling a first member to a second member. The attaching structure includes a latching element and the connecting assembly. The latching element is assembled to the first member. The connecting assembly includes a seat and a fastener. The seat adjustably latches to the latching element. The fastener is threaded into the first member, the second member, and matches with the seat.
Public/Granted literature
- US20120000907A1 ATTACHING STRUCTURE AND ELECTRONIC DEVICE USING SAME Public/Granted day:2012-01-05
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