Invention Grant
- Patent Title: Bimetallic spline seal
- Patent Title (中): 双金属花键密封
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Application No.: US12731186Application Date: 2010-03-25
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Publication No.: US08434999B2Publication Date: 2013-05-07
- Inventor: Sergio Daniel Marques Amaral , Gary Michael Itzel , Xiuzhang James Zhang
- Applicant: Sergio Daniel Marques Amaral , Gary Michael Itzel , Xiuzhang James Zhang
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: F01D11/00
- IPC: F01D11/00

Abstract:
A spline seal for a hot gas path component is provided. The spline seal may include a first metal layer and a second metal layer. The first metal layer may have a first volumetric thermal expansion coefficient. The second metal layer may be disposed adjacent the first metal layer and have a second volumetric thermal expansion coefficient. The second volumetric thermal expansion coefficient may be higher than the first volumetric thermal expansion coefficient. When the spline seal is exposed to a heat source, the first and second metal layers may deform to provide a seal between the hot gas path component and an adjacent hot gas path component.
Public/Granted literature
- US20110236183A1 BIMETALLIC SPLINE SEAL Public/Granted day:2011-09-29
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