Invention Grant
- Patent Title: Honeycomb extrusion die apparatus
- Patent Title (中): 蜂窝挤出模具设备
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Application No.: US12548927Application Date: 2009-08-27
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Publication No.: US08435025B2Publication Date: 2013-05-07
- Inventor: Daniel Wayne Corbett , Timothy Michael Miller
- Applicant: Daniel Wayne Corbett , Timothy Michael Miller
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Matthew J. Mason
- Main IPC: B29C47/20
- IPC: B29C47/20

Abstract:
Honeycomb extrusion die apparatus include a die body including a first set of die pins circumscribed by a second set of die pins. At least a portion of the end face of die pins of the second set of die pins are positioned along a peripheral surface extending at an oblique angle with respect to the extrusion direction. A lateral width of the open end of a plurality of discharge slots defined by the second set of die pins is larger than a lateral width of the open end of a plurality of discharge slots defined by the first set of die pins. Methods of making a honeycomb extrusion die apparatus are also provided.
Public/Granted literature
- US20110052745A1 Honeycomb Extrusion Die Apparatus And Methods Public/Granted day:2011-03-03
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