Invention Grant
- Patent Title: Board connector and method of mounting it
- Patent Title (中): 板连接器及其安装方法
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Application No.: US13095160Application Date: 2011-04-27
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Publication No.: US08435051B2Publication Date: 2013-05-07
- Inventor: Takashi Tonosaki
- Applicant: Takashi Tonosaki
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2010-110942 20100513
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00

Abstract:
A housing (10) has inserting portions (63) with projections (17) formed with slits (19). An alignment plate (60) is mounted movably on the housing (10) and has inserting portions (63) that enter the slits (19) of the projections (17). The alignment plate (60) is displaced relative to the housing (10) in the process of mounting a housing (10) on a board (90) due to interference with the board (90) and the inserting portions (63) move deeper into the slits (19). The projections (17) widen the slits (19) as the inserting portions (63) move deeper into the slits (19) and hence leading ends of the projections (17) engage opening edges of the mounting holes (92) of the board (90) to fix the housing (10) to the board (90).
Public/Granted literature
- US20110281462A1 BOARD CONNECTOR AND METHOD OF MOUNTING IT Public/Granted day:2011-11-17
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