Invention Grant
US08435351B2 Method and system for measuring a flow rate in a solid precursor delivery system
有权
用于测量固体前驱体输送系统中的流速的方法和系统
- Patent Title: Method and system for measuring a flow rate in a solid precursor delivery system
- Patent Title (中): 用于测量固体前驱体输送系统中的流速的方法和系统
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Application No.: US10998393Application Date: 2004-11-29
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Publication No.: US08435351B2Publication Date: 2013-05-07
- Inventor: Mirko Vukovic
- Applicant: Mirko Vukovic
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Wood, Herron & Evans, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/52
Abstract:
Improved measurement accuracy for determining the flow rate of precursor vapor to the deposition tool, particularly for use with low vapor pressure precursors, such as ruthenium carbonyl (Ru3(CO)12) or rhenium carbonyl (Re2(CO)10). In one embodiment, the system includes a differential pressure manometer is provided for measuring the flow rate. A method of measurement and calibration is also provided.
Public/Granted literature
- US20060115589A1 Method and system for measuring a flow rate in a solid precursor delivery system Public/Granted day:2006-06-01
Information query
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