Invention Grant
- Patent Title: Laminating device and method for laminating
- Patent Title (中): 层压装置和层压方法
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Application No.: US12667167Application Date: 2008-08-22
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Publication No.: US08435365B2Publication Date: 2013-05-07
- Inventor: Ike Gerke De Vries
- Applicant: Ike Gerke De Vries
- Applicant Address: NL Delft
- Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO
- Current Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO
- Current Assignee Address: NL Delft
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: EP07111448 20070629
- International Application: PCT/NL2008/050562 WO 20080822
- International Announcement: WO2009/005356 WO 20090108
- Main IPC: B32B37/00
- IPC: B32B37/00

Abstract:
A method is described for providing a substrate foil (L0) with at least a laminating foil (L1) of material. The method comprises the steps of providing the substrate foil (L0) and the laminating foil (L1). And subsequently applying weakend portions (100) in the laminating foil (L1). The weakened portions extend in a direction transverse (Dtr) to a longitudinal direction of the laminating foil, and are spaced at intervals along the longitudinal direction. The weakened portions have a width (w) substantially smaller than the length (Δ) of said intervals, providing a tension to the laminating foil (L1) in the longitudinal direction (Dlong). Thereby the laminating foil (L1) is stretched in the weakened portions, attaching the stretched laminating foil (L1) to the substrate foil (L0).
Public/Granted literature
- US20110011519A1 Laminating Device and Method for Laminating Public/Granted day:2011-01-20
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