Invention Grant
- Patent Title: Sheet peeling apparatus and sheet peeling method
- Patent Title (中): 薄片剥离装置和薄片剥离方法
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Application No.: US12936850Application Date: 2009-03-16
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Publication No.: US08435366B2Publication Date: 2013-05-07
- Inventor: Hideaki Kato
- Applicant: Hideaki Kato
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-103401 20080411
- International Application: PCT/JP2009/055013 WO 20090316
- International Announcement: WO2009/125651 WO 20091015
- Main IPC: B32B41/00
- IPC: B32B41/00

Abstract:
A sheet peeling apparatus 10 includes: a sticking means 14 for sticking a peeling tape PT by pressing the peeling tape PT onto an adhesive sheet S; a moving means 15 for moving the peeling tape PT stuck to the adhesive sheet S and a holding means 11 for holding a wafer W relative to each other to peel the adhesive sheet S; a detecting means 17 for detecting the position of the outer periphery of the adhesive sheet S, and outputting a signal thereof; an input means 18 for inputting a correction value; a controlling means 19 for determining a pressing position of the peeling tape PT to the adhesive sheet S based on the output signal from the detecting means 17 and the correction value, and controlling the moving means 15 so as to stick the adhesive sheet S at the pressing position.
Public/Granted literature
- US20110036477A1 SHEET PEELING APPARATUS AND SHEET PEELING METHOD Public/Granted day:2011-02-17
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