Invention Grant
US08435366B2 Sheet peeling apparatus and sheet peeling method 有权
薄片剥离装置和薄片剥离方法

  • Patent Title: Sheet peeling apparatus and sheet peeling method
  • Patent Title (中): 薄片剥离装置和薄片剥离方法
  • Application No.: US12936850
    Application Date: 2009-03-16
  • Publication No.: US08435366B2
    Publication Date: 2013-05-07
  • Inventor: Hideaki Kato
  • Applicant: Hideaki Kato
  • Applicant Address: JP Tokyo
  • Assignee: Lintec Corporation
  • Current Assignee: Lintec Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Westerman, Hattori, Daniels & Adrian, LLP
  • Priority: JP2008-103401 20080411
  • International Application: PCT/JP2009/055013 WO 20090316
  • International Announcement: WO2009/125651 WO 20091015
  • Main IPC: B32B41/00
  • IPC: B32B41/00
Sheet peeling apparatus and sheet peeling method
Abstract:
A sheet peeling apparatus 10 includes: a sticking means 14 for sticking a peeling tape PT by pressing the peeling tape PT onto an adhesive sheet S; a moving means 15 for moving the peeling tape PT stuck to the adhesive sheet S and a holding means 11 for holding a wafer W relative to each other to peel the adhesive sheet S; a detecting means 17 for detecting the position of the outer periphery of the adhesive sheet S, and outputting a signal thereof; an input means 18 for inputting a correction value; a controlling means 19 for determining a pressing position of the peeling tape PT to the adhesive sheet S based on the output signal from the detecting means 17 and the correction value, and controlling the moving means 15 so as to stick the adhesive sheet S at the pressing position.
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