Invention Grant
- Patent Title: Drywall tape dispenser assembly
- Patent Title (中): 干墙胶带分配器总成
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Application No.: US12802478Application Date: 2010-06-08
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Publication No.: US08435377B1Publication Date: 2013-05-07
- Inventor: Rodney K. Greenhalgh
- Applicant: Rodney K. Greenhalgh
- Agent Emery L Tracy
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B27/00 ; B32B37/00 ; B44C7/00 ; E04D15/00 ; E04B2/00

Abstract:
A drywall tape dispenser assembly for dispensing joint tape and joint compound used in finishing joints in sheetrock or drywall is provided. The drywall tape dispenser assembly comprises a main body having a first side wall, a second side wall, a bottom wall, a front wall, and a rear wall, with the first side wall, the second side wall, the bottom wall, the front wall, and the rear wall creating a mud receiving area. A first slot is formed between the front wall and the bottom wall and a second slot formed between the rear wall and the bottom wall. A tape dispensing mechanism dispenses the tape into and out of the mud receiving area wherein an amount of joint compound is placed in the mud receiving area over a portion of the joint tape within the mud receiving area and wherein a desired amount of joint tape is pulled through second slot, through the joint compound in the mud receiving area, and out of the first slot with a coating of joint compound thereon.
Information query