Invention Grant
- Patent Title: Reactive sputter deposition processes and equipment
- Patent Title (中): 反应溅射沉积工艺和设备
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Application No.: US11590438Application Date: 2006-10-31
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Publication No.: US08435388B2Publication Date: 2013-05-07
- Inventor: Klaus Hartig , Sören Berg , Tomas Nyberg
- Applicant: Klaus Hartig , Sören Berg , Tomas Nyberg
- Applicant Address: US MN Eden Prairie
- Assignee: Cardinal CG Company
- Current Assignee: Cardinal CG Company
- Current Assignee Address: US MN Eden Prairie
- Agency: Fredrikson & Byron, P.A.
- Main IPC: C23C14/35
- IPC: C23C14/35
Abstract:
The invention is a method for obtaining a reactive sputtering process with a reduced or eliminated hysteresis behavior. This is achieved by employing a target made from a mixture of metal and compound materials. In the method according to the present invention, the fraction of compound material is large enough to eliminate or significantly reduce the hysteresis behavior of the reactive sputtering process and enable a stable deposition of compound films at a rate significantly higher than what is possible from a target completely made from compound material.
Public/Granted literature
- US20070131536A1 Reactive sputter deposition processes and equipment Public/Granted day:2007-06-14
Information query
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