Invention Grant
- Patent Title: Method for forming a conductive pattern and a wired board
- Patent Title (中): 形成导电图案和布线板的方法
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Application No.: US11410254Application Date: 2006-04-25
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Publication No.: US08435440B2Publication Date: 2013-05-07
- Inventor: Hiroto Sugahara
- Applicant: Hiroto Sugahara
- Applicant Address: JP Nagoya-shi, Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi, Aichi-ken
- Agency: Baker Botts L.L.P.
- Priority: JP2005-126582 20050425
- Main IPC: H05K3/10
- IPC: H05K3/10

Abstract:
A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material.
Public/Granted literature
- US20060237229A1 Method for forming pattern and a wired board Public/Granted day:2006-10-26
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