Invention Grant
- Patent Title: Method of inspecting a substrate and method of preparing a substrate for lithography
- Patent Title (中): 检查基板的方法和制备光刻用基板的方法
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Application No.: US11802422Application Date: 2007-05-22
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Publication No.: US08435593B2Publication Date: 2013-05-07
- Inventor: Rik Teodoor Vangheluwe , Youri Johannes Laurentius Maria Van Dommelen , Johannes Anna Quaedackers , Cédric Désiré Grouwstra , Thijs Egidius Johannes Knaapen , Ralf Martinus Marinus Daverveld , Jeroen Hubert Rommers
- Applicant: Rik Teodoor Vangheluwe , Youri Johannes Laurentius Maria Van Dommelen , Johannes Anna Quaedackers , Cédric Désiré Grouwstra , Thijs Egidius Johannes Knaapen , Ralf Martinus Marinus Daverveld , Jeroen Hubert Rommers
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: C23C16/52
- IPC: C23C16/52
Abstract:
A method of inspecting a substrate with first and second layers thereon is disclosed. The method includes directing a beam of electromagnetic radiation at an acute angle towards an edge of the layers, detecting scattered and/or reflected electromagnetic radiation, and establishing, from results of the detecting, whether an edge of the second layer overlaps an edge of the first layer.
Public/Granted literature
- US20080292780A1 Method of inspecting a substrate and method of preparing a substrate for lithography Public/Granted day:2008-11-27
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