Invention Grant
- Patent Title: Method for dispensing random pattern of adhesive filaments
- Patent Title (中): 用于分配粘合剂长丝的随机图案的方法
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Application No.: US13288545Application Date: 2011-11-03
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Publication No.: US08435600B2Publication Date: 2013-05-07
- Inventor: Thomas Burmester , Hubert Kufner
- Applicant: Thomas Burmester , Hubert Kufner
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Wood, Herron & Evans, L.L.P.
- Main IPC: B05D5/10
- IPC: B05D5/10

Abstract:
A method of dispensing multiple adhesive filaments onto a substrate in a random pattern using asymmetrical pressurized process air. The method generally comprises moving the substrate along a machine direction and discharging multiple adhesive filaments from a plurality of liquid outlets. Pressurized process air is directed toward each one of the multiple adhesive filaments respectively along a first angle relative to a plane including an associated liquid outlet. Pressurized process air is also directed toward each one of the multiple adhesive filaments respectively along a second angle relative to the plane including the associated liquid outlet and on an opposite side of the associated liquid outlet than the pressurized process air directed along the first angle. The second angle is different than the first angle so that the pressurized process air is directed asymmetrically toward the multiple adhesive filaments.
Public/Granted literature
- US20120048447A1 METHOD FOR DISPENSING RANDOM PATTERN OF ADHESIVE FILAMENTS Public/Granted day:2012-03-01
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