Invention Grant
- Patent Title: Metal-ceramic substrate
- Patent Title (中): 金属陶瓷基板
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Application No.: US11990179Application Date: 2006-06-02
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Publication No.: US08435640B2Publication Date: 2013-05-07
- Inventor: Jürgen Schulz-Harder
- Applicant: Jürgen Schulz-Harder
- Applicant Address: DE Eschenbach
- Assignee: Curamik Electronics GmbH
- Current Assignee: Curamik Electronics GmbH
- Current Assignee Address: DE Eschenbach
- Agency: Welsh Flaxman & Gitler LLC
- Priority: DE102005038046 20050810; DE102005042554 20050908
- International Application: PCT/DE2006/000951 WO 20060602
- International Announcement: WO2007/016886 WO 20070215
- Main IPC: C04B37/02
- IPC: C04B37/02 ; C04B35/622 ; C04B37/00 ; B32B18/00 ; B32B7/02 ; B32B15/04

Abstract:
In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.
Public/Granted literature
- US20100260988A1 Metal-Ceramic Substrate Public/Granted day:2010-10-14
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