Invention Grant
- Patent Title: Method of manufacturing a substrate for liquid ejection head
- Patent Title (中): 液体喷射头用基板的制造方法
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Application No.: US13215492Application Date: 2011-08-23
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Publication No.: US08435805B2Publication Date: 2013-05-07
- Inventor: Taichi Yonemoto , Hiroyuki Abo , Keisuke Kishimoto
- Applicant: Taichi Yonemoto , Hiroyuki Abo , Keisuke Kishimoto
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2010-198996 20100906
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.
Public/Granted literature
- US20120058578A1 METHOD OF MANUFACTURING A SUBSTRATE FOR LIQUID EJECTION HEAD Public/Granted day:2012-03-08
Information query
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