Invention Grant
US08435824B2 Backside illumination sensor having a bonding pad structure and method of making the same
有权
具有接合焊盘结构的背面照明传感器及其制造方法
- Patent Title: Backside illumination sensor having a bonding pad structure and method of making the same
- Patent Title (中): 具有接合焊盘结构的背面照明传感器及其制造方法
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Application No.: US13177686Application Date: 2011-07-07
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Publication No.: US08435824B2Publication Date: 2013-05-07
- Inventor: Shuang-Ji Tsai , Dun-Nian Yaung , Jeng-Shyan Lin , Jen-Cheng Liu , Wen-De Wang , Yueh-Chiou Lin
- Applicant: Shuang-Ji Tsai , Dun-Nian Yaung , Jeng-Shyan Lin , Jen-Cheng Liu , Wen-De Wang , Yueh-Chiou Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/00
Abstract:
The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure comprises a device substrate having a front side and a back side; an interconnect structure disposed on the front side of the device substrate; and a bonding pad connected to the interconnect structure. The bonding pad comprises a recessed region in a dielectric material layer; a dielectric mesa of the dielectric material layer interposed between the recessed region; and a metal layer disposed in the recessed region and on the dielectric mesa.
Public/Granted literature
- US20130009270A1 BACKSIDE ILLUMINATION SENSOR HAVING A BONDING PAD STRUCTURE AND METHOD OF MAKING THE SAME Public/Granted day:2013-01-10
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