Invention Grant
- Patent Title: Optimization of desiccant usage in a MEMS package
- Patent Title (中): MEMS封装中干燥剂使用的优化
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Application No.: US12680503Application Date: 2007-09-28
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Publication No.: US08435838B2Publication Date: 2013-05-07
- Inventor: Yen Hua Lin , Rihui He , Lingling Wu , Lauren Palmateer , David Heald
- Applicant: Yen Hua Lin , Rihui He , Lingling Wu , Lauren Palmateer , David Heald
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear, LLP
- International Application: PCT/US2007/020985 WO 20070928
- International Announcement: WO2009/041951 WO 20090402
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.
Public/Granted literature
- US20110012219A1 OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE Public/Granted day:2011-01-20
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