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US08435846B2 Semiconductor devices with raised extensions 有权
具有凸起延伸的半导体器件

Semiconductor devices with raised extensions
Abstract:
Transistor devices and methods of their fabrication are disclosed. In one method, a dummy gate structure is formed on a substrate. Bottom portions of the dummy gate structure are undercut. In addition, stair-shaped, raised source and drain regions are formed on the substrate and within at least one undercut formed by the undercutting. The dummy gate structure is removed and a replacement gate is formed on the substrate.
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