Invention Grant
- Patent Title: Reverse-conducting semiconductor device and method for manufacturing such a reverse-conducting semiconductor device
- Patent Title (中): 反向导电半导体器件及其制造方法
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Application No.: US12819646Application Date: 2010-06-21
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Publication No.: US08435863B2Publication Date: 2013-05-07
- Inventor: Munaf Rahimo , Wolfgang Janisch , Eustachio Faggiano
- Applicant: Munaf Rahimo , Wolfgang Janisch , Eustachio Faggiano
- Applicant Address: DE Zürich
- Assignee: ABB Technology AG
- Current Assignee: ABB Technology AG
- Current Assignee Address: DE Zürich
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: EP07150165 20071219
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L21/8222

Abstract:
A reverse-conducting semiconductor device (RC-IGBT) including a freewheeling diode and an insulated gate bipolar transistor (IGBT), and a method for making the RC-IGBT are provided. A first layer of a first conductivity type is created on a collector side before a second layer of a second conductivity type is created on the collector side. An electrical contact in direct electrical contact with the first and second layers is created on the collector side. A shadow mask is applied on the collector side, and a third layer of the first conductivity type is created through the shadow mask. At least one electrically conductive island, which is part of a second electrical contact in the finalized RC-IGBT, is created through the shadow mask. The island is used as a mask for creating the second layer, and those parts of the third layer which are covered by the island form the second layer.
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