Invention Grant
- Patent Title: Thermal receiver elements and imaging assemblies
- Patent Title (中): 热接收元件和成像组件
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Application No.: US12823187Application Date: 2010-06-25
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Publication No.: US08435925B2Publication Date: 2013-05-07
- Inventor: Narasimharao Dontula , Somsack Chang , Jeffrey R. Gillmor
- Applicant: Narasimharao Dontula , Somsack Chang , Jeffrey R. Gillmor
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: B41M5/50
- IPC: B41M5/50

Abstract:
An imaging element has a substrate, an extruded, non-voided compliant layer and an image receiving layer. The extruded, non-voided compliant layer has a heat of fusion of equal to or greater than 0 and up to and including 45 joules/g of compliant layer as determined in a temperature range of from 25° C. to 147° C. by ASTM method D3418-08 and a tensile modulus value of less than 5×1010 dynes/cm2. These imaging elements can be used as thermal dye image transfer receiver elements to provide an image in combination with a thermal dye donor element in a thermal dye transfer process.
Public/Granted literature
- US20110318491A1 THERMAL RECEIVER ELEMENTS AND IMAGING ASSEMBLIES Public/Granted day:2011-12-29
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