Invention Grant
US08436126B2 Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board
有权
用于粘合片的树脂组合物和使用柔性印刷电路板的组合物的粘合片
- Patent Title: Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board
- Patent Title (中): 用于粘合片的树脂组合物和使用柔性印刷电路板的组合物的粘合片
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Application No.: US11879464Application Date: 2007-07-17
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Publication No.: US08436126B2Publication Date: 2013-05-07
- Inventor: Shinichi Hasegawa , Fumiki Higuchi , Toru Ueki
- Applicant: Shinichi Hasegawa , Fumiki Higuchi , Toru Ueki
- Applicant Address: JP Niigata
- Assignee: Arisawa Mfg. Co., Ltd.
- Current Assignee: Arisawa Mfg. Co., Ltd.
- Current Assignee Address: JP Niigata
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2006-196773 20060719
- Main IPC: C08G59/08
- IPC: C08G59/08
Abstract:
The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.
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