Invention Grant
- Patent Title: Amorphous multi-component metallic thin films for electronic devices
- Patent Title (中): 用于电子器件的非晶多组分金属薄膜
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Application No.: US12777194Application Date: 2010-05-10
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Publication No.: US08436337B2Publication Date: 2013-05-07
- Inventor: E. William Cowell, III , John F. Wager , Brady J. Gibbons , Douglas A. Keszler
- Applicant: E. William Cowell, III , John F. Wager , Brady J. Gibbons , Douglas A. Keszler
- Applicant Address: US OR Corvallis
- Assignee: The State of Oregon Acting By and Through The State Board of Higher Education on Behalf of Oregon State Unitiversity
- Current Assignee: The State of Oregon Acting By and Through The State Board of Higher Education on Behalf of Oregon State Unitiversity
- Current Assignee Address: US OR Corvallis
- Agency: Dann, Dorfman, Herrell & Skillman, PC
- Agent Niels Haun
- Main IPC: H01L29/72
- IPC: H01L29/72 ; H01L21/02
Abstract:
An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.
Public/Granted literature
- US20100289005A1 AMORPHOUS MULTI-COMPONENT METALLIC THIN FILMS FOR ELECTRONIC DEVICES Public/Granted day:2010-11-18
Information query
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